PCB Fabrication is one of our primary services, which is also known as PCB Manufacturing, PCB Printing Service. All our services are under NDA(הסכם סודיות) Protection which makes you stay away from intellectual property concern. Below are the PCB types we manufacture.

עופרת זמן(Days)

Single/double side 4 שכבת 6 שכבת over 8 שכבת HDI
Sample lead time(Normal) 5-6 6-7 7-8 10-12 15-20
Sample lead time(Fastest) 48-72 hours 5 6 6-7 12
Mass production lead time(First batch) 7-9 10-12 13-15 16 20

PCB Fabrication Capability

PCB Fabrication Capability
No פריט PCB Process Capability
1 base material Normal TG FR4, High TG FR4, PTFE, רוג'רס, Low Dk/Df etc.
2 צבע מסכת הלחמה green, אדום, כחול, לבן, צהוב, purple,שחור
3 Legend color לבן, צהוב, שחור, אדום
4 Surface treatment type מסכים, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 מקס. layer-up(L) 50
6 מקס. unit size (מ"מ) 620*813 (24″*32″)
7 מקס. working panel size (מ"מ) 620*900 (24″x35.4″)
8 מקס. עובי הלוח (מ"מ) 12
9 לי. עובי הלוח(מ"מ) 0.3
10 Board thickness tolerance (מ"מ) T<1.0 מ"מ: +/-0.10מ"מ ; T≥1.00mm: +/-10%
11 Registration tolerance (מ"מ) +/-0.10
12 לי. mechanical drilling hole diameter (מ"מ) 0.15
13 לי. laser drilling hole diameter(מ"מ) 0.075
14 מקס. aspect(through hole) 15:1
מקס. aspect(micro-via) 1.3:1
15 לי. hole edge to copper space(מ"מ) L≤10, 0.15;L=12-22,0.175L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16 לי. Inner layer clearance(מ"מ) 0.15
17 לי. hole edge to hole edge space(מ"מ) 0.28
18 לי. hole edge to profile line space(מ"מ) 0.2
19 לי. Inner layer copper to profile line space (מ"מ) 0.2
20 Registration tolerance between holes (מ"מ) ±0.05
21 מקס. finished copper thickness(um) Outer Layer: 420 (12עוז)
Inner Layer: 210 (6עוז)
22 לי. trace width (מ"מ) 0.075 (3אלף)
23 לי. trace space (מ"מ) 0.075 (3אלף)
24 Solder mask thickness (um) line corner: >8 (0.3אלף)
upon copper: >10 (0.4אלף)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 לי. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness (um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness (um) 3-15
35 profile size tolerance (מ"מ) ±0.08
36 מקס. solder mask plugging hole size (מ"מ) 0.7
37 BGA pad (מ"מ) ≥0.25 (HAL or HAL Free:0.35)
38 V-CUT blade position tolerance (מ"מ) +/-0.10
39 V-CUT position tolerance (מ"מ) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 לי. legend width (מ"מ) 0.1
44 Fire flame class 94V-0
Special for Via in pad boards Resin plugged hole size (min.) (מ"מ) 0.3
Resin plugged hole size (max.) (מ"מ) 0.75
Resin plugged board thickness (min.) (מ"מ) 0.5
Resin plugged board thickness (max.) (מ"מ) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (מ"מ) 0.4
different hole size in one board? yes
מקס. panel size (finished) (מ"מ) 880 ×580
מקס. working panel size (מ"מ) 914 × 602
מקס. עובי הלוח (מ"מ) 12
מקס. layer-up(L) 40
Aspect 30:1 (לי. hole: 0.4 מ"מ)
Line wide/space (מ"מ) 0.075/ 0.075
Back drill capability כן
Tolerance of back drill (מ"מ) ±0.05
Tolerance of press fit holes (מ"מ) ±0.05
Surface treatment type OSP, sterling silver, מסכים
נוקשה-פלקס board Hole size (מ"מ) 0.2
Dielectrical thickness (מ"מ) 0.025
Working Panel size (מ"מ) 350 x 500
Line wide/space (מ"מ) 0.075/ 0.075
Stiffener כן
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
טיפול שטח All
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (מ"מ) 0.075
מקס. dielectric thickness (מ"מ) 0.15
לי. dielectric thickness (מ"מ) 0.05
מקס. aspect 1.5:1
Bottom Pad size (under micro-via) (מ"מ) Hole size+0.15
Top side Pad size ( on micro-via) (מ"מ) Hole size+0.15
Copper filling or not (yes or no) (מ"מ) yes
Via in Pad design or not ( yes or no) yes
Buried hole resin plugged (yes or no) yes
לי. via size can be copper filled (מ"מ) 0.1
מקס. stack times 4